10 nm A11 Chip designing process completion by TSMC

According to DigiTimes, the TSMC (Taiwan Semiconductor Manufacturing Company) is already about to outline Apple’s A11 processor design built on a 10nm FinFEET process.

This means that the initial design and creation of masks to print the actual chips shall be completed. There might be however some problems while testing but the final result of the design by TSMC is to have its 10 nm manufacturing process certification by the end of this year with deliveries in early 2017.

TSMC shall be receiving two-thirds of its orders from Cupertino while small volume production for Apple’s A11 chips shall be in the second quarter of 2017 to give them revenue in the following quarter.

Barclays analyst Mark Moskowitz has expressed that Apple shall be skipping its usual S upgrade for its phone following the iPhone 7 but Apple is following its two year upgrade trend for its phones. Here all things shall remain same but the A11 would be changed for the iPhone 7S.

He further added that the iPhone 7S won’t be out wit upgraded specs but an iPhone 8 wit complete design changes and new specs and features shall make way independent of the A11 chip launch in the mid of 2017.

TSMC has been the manufacturer for Apple’s A10 that shall be in the iPhone 7 and iPhone 7 Plus. This was brought about by TSMC’s idea to have advanced device packing techniques with improved memory and low power consumption for the users to have greater performance and efficiency reloaded.

 

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